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Ansys Innovation Conference 2024 Singapore

Published on
October 29, 2024
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Thanks for joining CADIT & Ansys in Singapore at the Ansys Innovation Conference 2024!

Event Registration Link [Closed]:

https://www.ansys.com/webinars/accelerating-product-design-and-innovation-with-digitalization-and-ai-led-simulation

OCTOBER 3, 2024
8.30 AM TO 4:00 PM - GMT +8 (Singapore Time)

Event Venue
Grand Copthorne Waterfront Hotel
392 Havelock Road,
Singapore 169663

Register Early with CADIT to secure your spot! 50 Seats!

CADIT invites you to the Ansys Innovation Conference 2024 hosted in Singapore

Due the success of Ansys' global Innovation conferences, we are pleased to announce a collaborative limited seat event held in-person in Singapore.
Connect with CADIT to secure your spot through the official Ansys sign up link above & contact us to join us for a day of learning about how Digitalization & AI Simulation impacts Product Design and Innovation in the defense, aerospace, transportation, high-tech, semiconductor and electronics industries.

Keynotes by Industry leaders offer insights on current and future trends.

Industry Tracks

Defense, Mobility, and Transportation
The defense and mobility industry is undergoing a disruptive transition with the convergence of multiple technologies and megatrends. Companies need to accelerate design exponentially to deliver efficient, safe, and connected experiences. Engineers are increasingly adopting simulation and digitalization to accelerate product development. This track will focus on various aspects of
defense and mobility product development, from component to system validation.

High-tech, Semiconductors, and Electronics
In the rapidly evolving world of smart, connected, and autonomous technologies, semiconductors and electronics are ubiquitous across various low to high-frequency applications. Engineers face immense product reliability and performance challenges with numerous sensors, microprocessors, and communication components. Simulation is critical in helping high-tech companies deliver innovative and reliable products. This track will cover various topics, including electromagnetics, electromechanical, optics, connectivity, and more.

Product Tracks

Fluids & Mechanical

By gaining insights into the forces that affect fluid flow using CFD analysis or solving complex structural engineering challenges, simulation plays a very crucial role to help engineers make critical design decisions to improve product performance. This track will cover what’s new in Ansys Fluids & Mechanical products.

Electronics & Optics

Simulation enables the successful modeling, analysis and design of many of high- and low-frequency electronics applications, optics and photonics components, modules, circuits, and systems. This track will cover what’s new in Ansys Electronics & Optics products.

TimeSession
08:30 -   09:30Registration + Tea/Coffee
09:30 - 09:40Welcome Note and Context Setting
Sukhwan Moon, Area Vice President, Korea, Taiwan and ASEAN & ANZ, Ansys
09:40 - 10:00Ansys Corporate Keynote
Scott Davidson, VP Marketing, Ansys
10:00 -   10:15Industry Keynote
Hoo We Tak, DX Project Director, Hyundai Motor Group Innovation Center Singapore (HMGICS)
10:15- 10:30Advancing Product Design and Innovation with Simulation-Driven Digital Engineering
Padmesh Mandloi, Regional VP - Customer Excellence APAC, Ansys
10:30- 10:50Tea/Coffee + Networking + Technology Showcase
10:50- 11:05Industry Keynote: Driving Next-Gen Product Innovation - From Ideation to Design, Engineering, and Application
Rayner Ng Chun Piaw, Director, Innovation Factory, A*STAR SIMTech
11:05 - 11:20Industry Keynote
11:20 - 11:40Engineering What's Ahead in Space & Defense
Shuzo Otani, Area Vice President Sales, Aerospace and Defense, APAC, Ansys
11:40 - 12:00Virtualization of Chip-Package Co-design for Shift Left in Product Development
Vamsi Krishna, Director- Customer Excellence, Ansys
12:00 - 12:15Industry Keynote: Simulation & Material characterization for Heterogeneous Integration of Semiconductor Packaging
Dr. Lee Teck Kheng, Director of Technology Development Centre ITE College Central
12:15 -13:15Lunch Break
 Product Track 1
Fluids & Mechanical
Product Track 2:
Electronics & Optics
13:15 - 13:30What's New in Ansys Fluids
Bakytzhan Akhmetov, Senior Application Engineer, Ansys
What's New in Ansys Electronics
Desmond Tan, Principal Application Engineer, Ansys
13:30 - 13:45What's New in Ansys Mechnical
Dr. Yong Kin Yew, Technical Manager, CAD-IT Consultants (Asia) Pte Ltd
What's New in Ansys Optics
Eric Cheung, Application Engineering- Optics and Photonics, CADFEM SEA Pte Ltd
 Industry Track 1
Defense, Mobility and Transportation

Industry Track 2:
High-tech, Semiconductor and Electronics
13:45 - 14:05Electrification and Autonomy in Mobility
Shitalkumar Joshi, Senior Director, Ansys India-ASEAN
Multi-Chiplet Heterogeneous Integration for AI System in Package
Dr. Surya BHATTACHARYA, Director, System in Package (SiP), A*Star Institute of Microelectronics (IME)
14:05 -14:25University Microsatellite Structural Design and Simulation with Ansys Software Solutions
Lee Chon Kiat, Mechanical Lead, NTU-SaRC
Industry Presentation
PV Ramana Founder-CTO, LightSpeed Photonics
14:25 -14:45Digital Mission Engineering for Multi-Domain Defense Systems
Karynna Tuan, Manager Application Engineering, Ansys
Designing Next Generation RF Devices with Ansys Multiphysics Flow
Vamsi Krishna, Director- Customer Excellence, Ansys
14:45 -15:00Tea/Coffee + Networking + Technology Showcase
15:00-15:20Accelerating Autonomous Vehicle Testing with Simulation
Roshan Vijay, Head of Simulation-based Testing, Validation and Research, CETRAN
Thermomechanical Reliability of Electronics from 2.5D/3D-ICs to Systems
Bharat Panjawani, Lead Application Engineer, Ansys
15:20 - 15:35Q&AQ&A
15:35- 15:40Concluding RemarksConcluding Remarks
15:40 : 16:00 Networking + Technology Showcase

Ansys Simulation in Product Development - Current & Future Trends 2024

Industries are undergoing a rapid transformation, characterized by increasing complexity and stringent demands for efficiency, innovation, and sustainability.

Simulation, virtual prototyping, and digitalization are emerging as critical tools for accelerating product development. AI-augmented simulation, in particular, offers unprecedented speed and accuracy, enabling engineers to make informed decisions and optimize designs.

Join us at the Ansys Innovation Conference to explore how simulation is revolutionizing product development across industries. Discover the latest advancements, best practices, and real-world applications that are driving innovation and efficiency.

  • Create better products: Design products that are more reliable, efficient, and sustainable.
  • Develop products faster: Bring products to market more quickly.
  • Reduce costs: Save money by finding and fixing problems early.

Ansys Innovation Conference attendees will gain valuable insights into:

  • Next-gen product innovation trends
  • Multiphysics – Mechanical, CFD, Thermal, Electromagnetics
  • Electronics reliability, EMI/EMC
  • Chip/Package/Board
  • Optics and Photonics
  • Industry 4.0 / IoT
  • Advanced simulation practices
    • AI/ML, Cloud, GPU computing
    • Digital twin, MBSE, Automation

Recommended Attendees

This event is tailored for professionals involved in:

  • R&D engineers, managers, department heads
  • Design engineers, managers, department heads
  • Product development engineers, managers, department heads
  • Quality engineers, managers, department heads
  • Research, academia
  • Startups
  • Industries: aerospace and defense, high-tech, semiconductor
    and electronics, automotive, and transportation

Attendance will give you a competitive edge in your industry by staying informed about the latest advancements & implmentation steps for engineering and simulation.

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CADIT Distributes & Supports Ansys Fluent, Mechanical, Optics & Photonics, Icepak, SimAI &more

CADIT distributes Ansys Fluids, Ansys Mechanical, Ansys Optics & Photonics, Ansys Thermal, Ansys Electromagnetics & Ansys AI suites and more in Singapore, Thailand, Malaysia, Philippines, Indonesia, Brunei, Cambodia, Laos, Myanmar, Vietnam.

CADIT is proud to be an official Elite status Distributor Channel Partner & Service Provider for Ansys Products in the Asia Pacific region since 1993.

Ansys Lumerical vs Zemax vs Speos with CADIT

All Ansys Optics products are designed to integrate with each other- the question is which product to begin with.

Explore our optics feature page for a quick overview into the brief scope of each Ansys optics product's solving capabilities & as well as some common industry applications.

https://www.caditglobal.com/ansys/optics

We are currently building out more feature pages! Contact us if you'd like to experience a demo for your Ansys product sof interest

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